Fr-4 Fiberglass sheet

Features

The main technical characteristics and applications of yellow FR4 light board: are stable electrical insulation performance, good flatness, smooth surface, no pits, thickness tolerance exceeds the standard, and suitable for products that require high-performance electronic insulation, such as FPC reinforcement board, tin furnace High-temperature resistant plate, carbon diaphragm, precision planetary wheel, PCB test frame, electrical (electrical) equipment insulation partition, insulation backing plate, transformer insulation, motor insulation, deflection coil terminal board, electronic switch insulation board, etc.

Technical Data

Fiber-reinforced plastics Specifications:

1, Standard Thickness: 4,5,6,8,10mm

2, Standard Size: 1020x1220mm

3, ROHS SGS certificate.

4, High gloss and hard surface.

5. Providing services in die cutting holing, punching, and slitting as per customer's request.

Fiber-reinforced Plastics Cutting Services

The standard sheet size is 1020x1220mm, sheets can be cut into smaller sizes in our workshop before delivery and it’s free of charge, It will be easy for shipment and save process before use. Just let us know the size that you want when you place an order!

Fiber-reinforced plastics Free sample

We provide samples (size 160x160 mm) for testing or checking the quality … samples are free of charge, but should be sent by the customer’s courier account and freight collection.

Fiber-reinforced plastics Packing Detail:

Packing carton boxes and wooden boxes to keep the goods safe during the shipment.

Terms & Condition

Minimum Order Quantity : 500-kilo gram

Lead time: 10 days after confirmation.

Payment terms: 30% deposit, balance T.T. before shipment.

Production Process

In the epoxy resin fiberglass board, FR-4 glass fiberboard has always maintained its absolute advantage and dominant position, occupying most of the middle and high-end market. The main reason is that FR-4 integrates various industrial performances. And it has high flame retardancy, so the market favors it.

FR-4 resin glue

(1) Resin glue formula In the epoxy resin glass fiber board industry, FR-4 glass fiber board has been produced for many years, and the resin glue formula is basically the same.

(2) Preparation method: 1) Dimethylformamide and ethylene glycol methyl ether is stirred and mixed to form a mixed solvent. 2) Add dicyandiamide and stir to dissolve. 3) Add epoxy resin and stir to combine. 4) 2-methylimidazole is pre-dissolved in an appropriate amount of dimethylformamide, then added to the above materials, and continued to stir thoroughly. 5) After parking (curing) for 8 hours, take samples to test the relevant technical requirements.

(3) Technical requirements for resin glue: 1) The solid content is 65% to 70%. 2) Gel time (171°C) 200-250s.

Adhesive sheet

(1) Manufacturing process After the glass fiber cloth is unrolled, it passes through the guide roller and enters the glue tank. After dipping, it passes through extrusion rollers to control the resin content and then enters the oven. During the oven, the solvent and other volatiles are removed, while the resin is in a semi-cured state. After leaving the oven, cut them according to the size requirements, and neatly stacked them on the storage rack. Adjust the gap between extrusion rollers to control the resin content. Adjust the temperature, air volume, and vehicle speed of each temperature zone of the oven to control the gel time and volatile matter content.

(2) Testing method During the manufacturing process of the bonding sheet, in order to ensure quality, various technical requirements must be regularly tested. The detection method is as follows:

1) Resin content: ① At least 25mm from the edge of the bonding sheet, cut 3 samples according to the left, middle, and right width direction. The sample size is 100mm×100mm, and the diagonal line is parallel to the latitude and longitude. ② Weigh each sheet (W1), accurate to 0.001g. ③Put the sample in a muffle furnace of 524-593 (524-593), and burn it for more than 15 minutes, or until all carbides are removed. ④Move the sample to a desiccator and cool it to room temperature. ⑤Weigh each piece (W2), Accurate to 0.001g.⑥Calculation: Resin content=[(W1-W2)/W1]×100%.

2) Gel time: ①Cut a sample of about 20cm×20cm from the center of the adhesive sheet, rub the sample to make the resin powder fall into the metal sieve, and then sieve it onto a clean white paper. ②Take about 20mg of resin powder and place it in the center of the hot plate of the detector that has been heated to 171 (±0.5°C in advance. When the resin powder melts, start the stopwatch and stir the resin with a wooden toothpick. ③When the resin thickens to the point where the drawing is interrupted, stop the stopwatch. The elapsed time is the gel time.

3) Resin fluidity: ① Cut 4 samples from the edge of the bonding sheet not less than 5cm. The sample size is 100mm×100mm, and the diagonal line is parallel to the latitude and longitude. ② Weighing (W1), accurate to 0.005 grams. ③ The samples are aligned and stacked, and the release film is added, and then placed between two stainless steel plates. ④Place the steel plate and the sample in a press at 170°C±2.8°C, pressurize once, the unit pressure is 1.4MPa±0.2MPa, and keep it for 10min. ⑤Take out the sample and cool it to room temperature. ⑥ Die-cut a φ80mm disc from the center of the sample. ⑦Weigh the weight of the wafer (W2), accurately to 0.005g. ⑧ Calculation: Fluidity = [(Wl-2W2)/W1]×100%.

4) Volatile matter content: ① At least 25mm away from the edge of the bonding sheet, cut 3 samples according to the left, middle, and right of the width direction. The sample size is 100mm×100mm, and the diagonal line is parallel to the latitude and longitude. ②Pierce a small hole in one corner of each sample. ③Place the sample in a desiccator for 1 hour. ④ Weigh each sheet (W1), accurate to 0.001g. ⑤ Hang the sample in the oven, and bake at 163℃±2℃ for 15min. ⑥ Move the sample to a desiccator and cool for 10 minutes. ⑦ Weigh each sheet (W2), accurate to 0.001g. ⑧Calculation: volatile content = [(W1-W2)/W1]×100%

(3) Storage of adhesive sheets After the appearance and various technical indicators are tested, the adhesive sheets should be stacked neatly and stored according to requirements. The epoxy resin in the adhesive sheet is in a semi-cured state. During storage, the quality of the adhesive sheet will change with the storage conditions and storage time. The change in the moisture absorption rate of the adhesive sheet under various relative humidity conditions shows that the moisture absorption rate of the adhesive sheet increases significantly when the relative humidity is high. After the adhesive sheet absorbs moisture, it will seriously affect the product quality, especially since the dip soldering resistance will significantly deteriorate.

It can be seen that during the storage of adhesive sheets, moisture-proof issues must be given full attention! In order to ensure product quality, it is very necessary to emphasize that adhesive sheets should be stored under the conditions of temperature below 25°C and relative humidity below 50%.

suppress

The pressing process of epoxy resin copper-clad laminates is roughly divided into three stages: heating, heat preservation and cooling. The pressing process can be operated manually or controlled by a computer. In the heating stage, the heat is gradually transferred from the heating plate to each product between the layers, so that the resin melts and flows. At the same time, pressure is applied according to the melting and flow of the resin. According to my many years of work experience, this stage is the key to the pressing process. If the pressurization is not timely, it will cause "under pressure" and defects such as "microbubbles" and "dry flowers" will appear; on the contrary, if the pressurization is too early, it will lead to excessive glue flow. More or skateboarding and other issues.